Communication modules

RF modules

Main products
Connectivity modules, MetroCirc™, RF modules, etc.

Net sales (Billion yen)

Operating results

For f iscal 2018, sales in multilayer resin substrates achieved substantial growth as they were used in a new model of high-end smartphone. In addition, sales in modules for communication equipment also increased. As a result, overall net sales were 425.5 billion yen (up 7.7% year-on-year).

Connectivity modules

Connectivity modules are compound components for wirelessly accessing the Internet or other devices from various devices.

These are used in various types of familiar devices such as smartphones, tablets, digital cameras, home appliances, and car navigation systems, and in various settings, including enabling users to download and upload photos and music from the Internet, and call hands-free while driving.

With the 2020 Tokyo Olympics, 5G services will be launched in Japan. 5G includes communications using microwaves on sub-6GHz bands and millimeter wave bands, namely 28GHz and 39GHz. Murata can offer high-property modules that use proprietary multilayer resin substrates to keep transmission loss low on millimeter wave bands.

Additionally, in an IoT society where all types of objects around us are connected to the Internet, various types of devices will have wireless communication functions. Murata will promptly supply products that are easy for customers to use for automobiles and edge devices for various applications, by utilizing design technologies with high reliability for smaller and higher performance products alongside software technologies to enhance connectivity, while contributing to the development of an IoT society as our mission in creating the future of electronics.



MetroCirc™ is a thinner multilayer resin substrate comprising LCP (liquid crystal polymer) sheets with exceptional RF characteristics in many layers which facilitates a flexible bending process.

It is possible to design circuits by inserting copper foil sheets between LCP sheets, and these circuits are used as transmission wires, coils, and other functional components in smartphones, wearable devices, and other applications, contributing to smaller, thinner, and higher performance devices.

Millimeter waves and other high frequency waves are used in 5G, for which service will be launched this year and next year, so it may be expected that MetroCirc™ will be used in substrates for millimeter wave modules, millimeter wave transmission lines, and other applications that utilize the low transmission loss properties at high frequencies that is a feature of MetroCirc™.

In addition, we believe that there will be more opportunities for customers to favor MetroCirc™ as the frequencies used become higher, because this will further highlight MetroCirc™’s competitive superiority in terms of transmission loss compared with competing technologies.

Looking ahead, it is likely that customers will face more issues related to high frequency communications as the number of devices using 5G increases.

MetroCirc™ will contribute to resolving customers’ issues, through the combination of high performance materials and Murata’s unique ideas, developed based on our multilayer technology.

RF modules

Murata’s RF modules are multifunctional and high performance electronic component units that realize an analogue high frequency circuit that controls communications among wireless devices by integrating various key devices.

This module is comprised of passive devices such as SAW filters which demultiplex high frequencies and LC filters, high power amplifiers in transmission, low distortion amplifiers in reception, antenna changeover switches, and other semiconductor devices, and is actively used for various types of wireless devices including smartphones and tablet PCs.

Murata, which internally develops various key devices that form the basis for module configuration and package technologies for modularization, is able to carry out integrated production. As a result, Murata has a strong competitive advantage in terms of business speed, production capability, and quality, in addition to performance.

With the arrival of 5G, RF modules for realizing dual connectivity in addition to multiple frequency bands and carrier aggregation will become necessary. In addition, the modularization of electronic components is expected to advance in line with the miniaturization and increased functionalities of wireless devices. Murata will promptly identify future market and customer needs, while also leveraging our competitive advantages to propose RF modules most suitable to customers, as we aim to be a company selected by customers.