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Murata to Exhibit at 18th Embedded Systems Expo (ESEC)

2015-05-12

Murata Manufacturing Co., Ltd.
President/Statutory Representative Director:
Tsuneo Murata

NewsArticleTitle

Overview

Murata Manufacturing Co., Ltd. will conduct an exhibition at the 18th Embedded Systems Expo (ESEC), to be held at Tokyo Big Sight

Details

18th Embedded Systems Expo (ESEC)

Period: Wednesday, May 13 to Friday, May 15
Location: Tokyo Big Sight West Hall
URL: http://www.japan-it.jp/en/haru/
Booth No.:
West 1-74 

Summary

Murata will showcase wireless communication modules and sensors that can be embedded in various kinds of equipment, along with application examples.

Wireless communication solutions

• IoT cloud system framework

Murata will present a cloud system framework for IoT (Internet of Things) designed to enable accumulation, analysis, and visualization of data in ways that meet the needs of customers. These can be combined with Murata wireless modules, for example, to realize total solutions for applications ranging from collection of “little data” to utilization of “big data.”

• Murata will show wireless communication solutions that integrate hardware and software for one-stop total support. 
Radio Law certification service with support for Japanese domestic and overseas certification
Wireless LAN software service

Sensor devices

Murata will exhibit compact, low-power sensor nodes that combine sensor elements and algorithms.

Example sensor elements

  • Pressure sensor
  • SMD ultrasonic sensors

무라타에 대해서

주식 회사 무라타 제작소는 기능성 세라믹을 기반으로 전자 디바이스의 연구 개발 • 생산 • 판매를 행하고 있으며, 재료부터 제품까지 일관 생산 체제를 구축하고 있습니다. 또한, 무라타 제품의 90%이상은 해외에서 판매되고 있으며, 국내외로 글로벌 회사를 전개하고 있습니다.

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