MEMS sensors by Murata Electronics Oy realize high-precision detection through an original technology called 3D MEMS where silicon wafers are deeply etched with reactive ion etching. Use of 3D MEMS technology makes it possible to offer high reliability sensors with stable processes and reasonable cost.
Main features of 3D MEMS technologies are introduced below.
- Original via structure to realize high insulation and low parasitic capacitance
Original via structure is introduced at the extraction electrodes of MEMS structure.
- High-precision cavity control technology to make high sensitivity and downsizing possible
Very narrow 2.5µm space between the movable portion and cap wafer allows for high-precision capacitance measurement.
- Atomic-level hermetic sealing making high reliability possible
The movable portion and cap wafer are strongly joined together with anodic bondingbetween glass and silicon, or direct bonding between silicon and silicon oxide, to realize high reliability.