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This is a page on the eco-products that were certified in FY 2020.
10/1/2020
Digital equipment used in IoT and wearable devices are required to be compact and operate for long periods of time, resulting in a growing demand for smaller electronic components and lower power consumption. This product contributes to the power consumption reduction of Bluetooth® Low Energy.
This product contributes to downsizing automobile ECUs (electronic control units) and other devices.
High functionality, such as advanced driver assist system (ADAS) and automated driving, has required multilayer ceramic capacitors with reduced number of components, smaller size, and larger capacity. Thanks to thin layer forming and high-precision lamination techniques, this product is reduced in volume by approx. 60% than conventional products.
High functionality, such as advanced driver assist system (ADAS) and automated driving, has required multilayer ceramic capacitors with reduced number of components, smaller size, and larger capacity. Thanks to thin layer forming and high-precision lamination techniques, this product, whose capacity is approx. 10 times as large as that of conventional capacitors, contributes to the high performance and high functionality of automobiles.
As the modules of in-vehicle, industry, and electrical equipment have been downsized, and as SiC (Silicon Carbide) with excellent heat resistance have been spreading, electronic components are required to be downsized and endure high temperatures. Since this product employs a low-dissipation factor and temperature compensation type dielectric, it is optimum for downsizing large-current snubber circuits and making them resistant to high temperatures.
As 5G smartphones spread, and as wearable devices have become multi functional and downsized, electronic circuits are required to be further downsized, and their density needs to be increased. Thanks to thin layer forming and high-precision lamination techniques, this product is reduced in mounting area by approx. 35% and in volume by 50% than conventional products.
This product is a downsized POL DC-DC converter module that improves power density by 20% compared to conventional products thanks to the fusion of packaging technology and design technology. It contributes to energy and space reduction in the markets, such as telecommunication data centers, in which data capacity and data communication speed are increasing.
This product is a compact AI module realized with Google's Edge TPUIC that provides low power consumption and high performance machine learning and reasoning and small package technology. It contributes to low power consumption and space reduction in Edge devices that are required to have AI functions.
3/23/2020
Thanks to the technologies nurtured through multilayer ceramic capacitors and multilayer devices, this product achieves the 0603 size. Furthermore, its characteristics are stably maintained for a long time thanks to the adoption of unique ceramic materials. It contributes to the safety improvement, downsizing, and high density for electronic devices.
As 5G smartphones spread, and as wearable devices have become multi functional and downsized, electronic circuits are required to be further downsized, and their density needs to be increased. Thanks to the technologies of atomizing and homogenizing ceramics as well as electrode materials, this product, which is one of the smallest in size, achieves a capacitance of 0.1µF.