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Surface acoustic wave (SAW) filters, RF modules, Multilayer resin substrates (Multilayer LCP Product)
A SAW filter is a filter that can pick out electric signals in a particular frequency band, using the surface acoustic wave that propagates along the surface of the piezoelectric substrate. Ensuring smooth wireless communication between devices requires high-functioning filters that can let though electric signals in a particular frequency band, while eliminating noises of unnecessary frequency bands.
In addition to our proprietary I.H.P. and TC-SAW technologies, we will strengthen alliances for new technologies and strive to enhance cost competitiveness by improving productivity to respond to the rise of other manufacturers in the sector.
With the spread of 5G and next-generation Wi-Fi standards, the need for high-performance, high-frequency filters with a broad bandwidth is expected to increase. XBAR technology has advanced characteristics at high frequencies and in a broad bandwidth, as well as high compatibility with the SAW filter manufacturing process. This will strengthen our business as a differentiating technology for filters.
With the spread of IoT devices other than smartphones, wireless communications functions is added to various applications. In addition, with the introduction of 5G, the combination of incorporated frequency bands is becoming more complex, and the technical requirements for filters are becoming more challenging. Murata will expand its business in new markets by leveraging its technological strengths.
RF modules are electronic component units that realize an analogue high-frequency circuit that controls communications among wireless devices by integrating various key devices in a small package. This module is comprised of passive devices such as SAW filters, high-power amplifiers (PA) in transmission circuits, low-noise amplifiers (LNA) in reception circuits, antenna changeover switches and other semiconductor devices. RF modules are used for various types of wireless devices including smartphones and tablet PCs.
In the current competitive environment, the level of technology of competitors is very high. We will establish a competitive advantage by fostering or acquiring differentiated technologies.
We will differentiate ourselves from our competitors and capture business opportunities through the "Digital Envelope Tracking Technology” of Eta Wireless Inc., which we acquired in September 2021.
In the 5G and the 6G era, which is also called Beyond 5G, “ultra-low power consumption” and “ultra-reliable communication” are required. In order to survive in the global competition, we will continue to strengthen the high technological capabilities and high-quality monozukuri that Murata has cultivated over the years.
Multilayer LCP Product is a thinner multilayer resin substrate comprising LCP (liquid crystal polymer) sheets. It features exceptional RF characteristics and realizes a substrate with a stable performance due to low water absorption. It is also characterized by the ability to handle a flexible bending process because it does not require an adhesive layer. In addition, high multiple layers are possible by using Murata’s multilayer technology, enabling high flexibility in design. Multilayer LCP Product is used in smartphones, wearable devices, and other applications, contributing to smaller, thinner, and higher performance devices with low energy consumption.
In addition to earnings in existing business areas, we will expand our customer base and diversify revenue sources, including strengthening internal synergies.
We will further strengthen our competitive advantage in terms of characteristics and structure in high-frequency fields such as 5G millimeter wavebands and UWB.
We will strengthen our manufacturing capabilities and cost competitiveness by continuing productivity improvement activities. In addition, we will work on advance easures to establish supply chains for realizing sustainable material use.