Surface Mount Technology | Production Technology | Murata technology platform

Summary

General surface mount technology involves electrically and mechanically bonding electronic components to printed circuit boards to complete electrical circuits. A representative example is the “reflow soldering process,” which involves printing solder paste, mounting components, and performing reflow soldering.
Murata's surface mount technology excels in the ultra-fine narrow-adjacency mounting of cutting-edge miniature components. Its core technologies consist of fine printing technology, high-precision mounting technology, soldering control technology, advanced packaging technology that combines these technologies, and reliability enhancement technology.
The strength of this surface mount technology lies in its continuous evolution alongside miniaturization, exemplified by products such as Multilayer Ceramic Capacitors (MLCC), EMI suppression products, and thermistors. Currently, we are pursuing new fine-pitch surface mount technology compatible with the world's smallest 016008 size components. Furthermore, these technologies are deployed in Murata's module products, enabling compact, high-performance connectivity modules and highly reliable automotive and power modules.
The evolution of surface mount technology requires the refinement of solder materials and the development of high-precision placement equipment to accommodate increased functionality and miniaturization. We have honed these technologies collaboratively with partner companies, establishing industry standards. Moving forward, we will continue pursuing cutting-edge technologies, delivering new value as standard capabilities, and contributing to the advancement of high-performance electronic devices and the growth of the industry.

Technical Explanation
Technological Strengths
Technological Advancement
Application examples for this technology

Murata's Surface Mount Technology

Technical Explanation

Murata's surface mount technology develops materials, equipment, and design technologies in line with the miniaturization and characteristic optimization of its own electronic components. The results of our pursuit of new mounting technologies are provided as one aspect of product value.

Micro-Printing Technology: Micro-printing of solder paste is critical for product miniaturization. We achieve this through material development suitable for micro-printing and mask design optimization in collaboration with material manufacturers.
High-Precision Mounting Technology: We collaborate with various manufacturers to develop equipment and packaging materials that enable higher precision and faster mounting, pursuing high-density and narrow-pitch mounting.
Soldering Control Technology: To achieve high-quality soldering, we optimize not only materials and equipment but also PCB land design and reflow conditions. We research these as critical application information and also provide technical support.
Packaging Technology: We pursue advanced circuit design technology and cutting-edge mounting and packaging techniques that leverage it, developing and providing high-functionality module products.
Reliability Enhancement Technology: Based on the usage environment after components are mounted, we evaluate soldering performance and joint reliability against stringent standards and carry out manufacturing that addresses a wide range of applications from the design and development stages.

Electronic Component Surface Mount Technology

Mounting and Packaging Technology for Realizing High-Function Modules

Technological Strengths

Murata's strength in surface mount technology is based on the philosophy of “challenging technological limits and co-creating new value.” This enables us to excel in ultra-fine narrow-adjacency mounting (high-density mounting). Even when faced with difficult challenges, Murata collaborates with partner companies and customers to develop new materials and high-precision equipment, turning the impossible into reality. As a result, Murata has established ultra-fine narrow-pitch surface mount technology compatible with 0201M size components, enabling the widespread adoption of world-class smallest components while also delivering high-performance module products.

Beyond high-density mounting, we rapidly adopt new bonding materials and methods—such as low-temperature mounting, high-reliability mounting, bulk surface mount technology, and solder-alternative mounting techniques—while advancing research on product compatibility, challenges, and countermeasures. Through pioneering mounting technologies, we continue to expand the possibilities of electronic components, delivering new value to the market and our customers.

Miniaturization of Electronic Components and Surface Mount Technology

Technological Advancement

Murata's surface mount technology has continued to evolve alongside the miniaturization of electronic components and the increasing density of module products. In the late 1970s, during the transition from through-hole devices (THD) to surface-mount devices (SMD), Murata pioneered the establishment of automated surface mount technology using tape reel supply. This initiative significantly contributed to the industry standardization and advancement of the reflow soldering process.

In the early 2000s, Murata was among the first to develop its own products compatible with lead-free solder. By providing mounting and reliability-related application support for these products, Murata also contributed to the realization and widespread adoption of lead-free solder mounting. Since then, Murata has continued to evolve by developing technologies such as fine printing for ultra-small components such as 0402M and 0201M size components, high-precision mounting, and solder joint technologies.

Moving forward, alongside pursuing advanced mounting technologies, we will focus on establishing sustainable mounting processes. This includes adopting low-environmental-impact materials, realizing energy-saving lines, and reducing waste. Furthermore, we will integrate with fine semiconductor manufacturing technologies and advance the development of new joining technologies. This will build the technological foundation to contribute to the future electronics society.