Multi-layer LCP product continues to evolve in its structure, materials, and manufacturing processes to meet the growing demands for higher speed, larger capacity, and higher-frequency communications in smartphones, wearable devices, and other applications.
In the early stages of development, Multi-layer LCP product was mainly used for transmission lines and antenna applications.
Subsequently, modularization and collaboration with other Murata products expanded its range of applications.
In recent years, with a view toward the evolution of 5G (fifth-generation mobile communications) and future 6G (sixth-generation mobile communications), Murata has been advancing development aimed at lower dielectric constants, further miniaturization, and higher reliability.
In 2025, Murata began mass production of the world’s first ultra-low dielectric constant LCP flexible substrate incorporating a hollow structure.
By adopting a unique design with hollow regions inside the substrate, this product achieves an extremely low dielectric constant (Dk) of less than 2.0, significantly reducing transmission loss.
In this way, Multi-layer LCP product continues to advance low-loss signal transmission and highly flexible three-dimensional structural technologies by leveraging the high degree of structural freedom made possible by its proprietary batch lamination technology.
Murata will continue to deliver products that contribute significantly to the realization of next-generation devices.
Cross-sectional image
Comparison of Characteristics with Conventional Products
Source of inserted image: ULTICIRC