Examples of Technology Application ~Product Introduction~ Murata’s Unique Technology Creates New Markets: Multi-layer LCP product

Key Technologies Used: Organic Materials Technology, Green Sheet Process Technology, Heat Treatment Technology, Precision Processing Technology, Metallic Materials Technology, Simulation Technology, Application/Solution Design Technology, Surface Mount Technology, Reliability Technology, Connectivity Component Design Technology

Multi-layer LCP product

Summary

  • Murata Manufacturing’s Multi-layer LCP product is a multilayer resin substrate that combines long-established lamination technology with proprietary materials.
  • Through unique processes, including Murata’s original single-press lamination method, Multi-layer LCP product achieves excellent high-frequency characteristics.
    At the same time, it offers high humidity resistance and outstanding shape retention, delivering added value across a wide range of applications.
  • Murata is also developing new structures and technologies that leverage the strengths of Multi-layer LCP product, and further evolution is expected in the future.

Murata's Multi-layer LCP product

Product Description

Murata’s Multi-layer LCP product is a multilayer resin substrate made of LCP (liquid crystal polymer) that enables flexible three-dimensional routing of wiring within the circuit board.
Multi-layer LCP product transmits high-frequency signals with low loss while supporting high-density circuit routing.
The LCP used as the base material has a low dielectric constant, which results in minimal signal loss.
Compared with conventional glass epoxy substrates, this makes Multi-layer LCP product well suited for 5G communications and high-frequency circuits.
Its multilayer structure combined with copper foil enables complex circuit designs and high-density mounting.
As a result, Multi-layer LCP product is widely used in applications such as smartphones and communication equipment.
In addition, its extremely low moisture absorption significantly reduces performance degradation caused by environmental changes.

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Murata’s Multi-layer LCP product
Murata’s Multi-layer LCP product

Product Strengths

The greatest strength of Murata’s Multi-layer LCP product lies in its excellent high-frequency performance.
Its low-loss signal transmission in the high-frequency range provides significant value in mobile communication devices, where wireless data transmission speeds continue to increase in products such as smartphones, tablets, and wearable devices.
By suppressing signal degradation and maintaining stable communication quality, Multi-layer LCP product contributes to performance improvement of communication equipment.
The core technologies behind Multi-layer LCP product are Murata’s multilayer technology, cultivated through products such as Multilayer Ceramic Capacitors (MLCC), and its proprietary high-performance resin materials.
Unlike conventional multilayer resin substrates, Multi-layer LCP product employs a unique process that enables single-step pressing without the use of adhesives.
This technology solves challenges that were difficult to address with conventional resin substrates, including shape retention and humidity resistance.

In addition, laser cutting is used in the product singulation process, allowing flexible adaptation to complex outer-shape requirements.
Because no molds are required, design changes are easy, enabling shorter lead times and lower costs.

Furthermore, materials used in Multi-layer LCP products excel in forming and retaining three-dimensional shapes.
Conventional FPCs (flexible printed circuits) often suffer from springback, which makes shape retention difficult.
Multi-layer LCP product overcomes this issue through its material properties and bending process.
Because the bent shape can be maintained as is, integration into enclosures becomes easier, contributing to improved assembly efficiency and reduced man-hours.

Multi-layer LCP product core technologies
Multi-layer LCP product core technologies

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Product Evolution

Multi-layer LCP product continues to evolve in its structure, materials, and manufacturing processes to meet the growing demands for higher speed, larger capacity, and higher-frequency communications in smartphones, wearable devices, and other applications.

In the early stages of development, Multi-layer LCP product was mainly used for transmission lines and antenna applications.
Subsequently, modularization and collaboration with other Murata products expanded its range of applications.

In recent years, with a view toward the evolution of 5G (fifth-generation mobile communications) and future 6G (sixth-generation mobile communications), Murata has been advancing development aimed at lower dielectric constants, further miniaturization, and higher reliability.

In 2025, Murata began mass production of the world’s first ultra-low dielectric constant LCP flexible substrate incorporating a hollow structure.
By adopting a unique design with hollow regions inside the substrate, this product achieves an extremely low dielectric constant (Dk) of less than 2.0, significantly reducing transmission loss.

In this way, Multi-layer LCP product continues to advance low-loss signal transmission and highly flexible three-dimensional structural technologies by leveraging the high degree of structural freedom made possible by its proprietary batch lamination technology.
Murata will continue to deliver products that contribute significantly to the realization of next-generation devices.

Cross-sectional image
Cross-sectional image
Comparison of Characteristics with Conventional Products
Comparison of Characteristics with Conventional Products

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Product Applications

Multi-layer LCP products are used as transmission line components for smartphones, tablets, and wearable devices.
They are also employed as composite components that integrate antennas with matching circuits.

  • Transmission Line Solutions: Used as transmission line components for high-frequency signal transmission.
  • Antenna Solutions: Antennas formed with Multi-layer LCP products can be easily connected via connectors to create simple antenna configurations.
  • Board Solutions: Used as high-density, thin-profile boards for various applications.
  • Module Solutions: Used as PCBs for mounting a wide range of components.
Applications of the Multi-layer LCP product
Applications of the Multi-layer LCP product

Check the product information site for product specifications, etc.

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