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Surface acoustic wave (SAW) filters, RF modules, Multilayer resin substrates (Multilayer LCP Product)
A SAW filter is a filter that can pick out electric signals in a particular frequency band, using the surface acoustic wave that propagates along the surface of the piezoelectric substrate. Ensuring smooth wireless communication between devices requires high-functioning filters that can let though electric signals in a particular frequency band, while eliminating noises of unnecessary frequency bands.
In addition to our proprietary I.H.P. and TC-SAW technologies, we will strengthen alliances for new technologies and strive to enhance cost competitiveness by improving productivity to respond to the rise of other manufacturers in the sector.
With the increase in sophistication of 5G, Wi-Fi 6E/7, and other communications standards, the need for high-frequency filters with a broad bandwidth is rising. We have begun mass production and shipment of high-frequency filters using XBAR technology. Through this, we aim to expand the business by leveraging their outstanding characteristics at high frequencies and in a broad bandwidth, as well as their high compatibility with the SAW filter manufacturing process.
Wireless communications functions are increasingly being added to various applications beyond smartphones. In addition, with communications standards becoming increasingly sophisticated, the technical requirements for filters are also becoming more challenging. For example, the frequency bands used and their combinations are becoming more complex. Murata will expand its business in new markets by leveraging its technological capabilities.
RF modules are electronic component units that realize an analogue high-frequency circuit that controls communications among wireless devices by integrating various key devices in a small package. This module is comprised of passive devices such as SAW filters, high-power amplifiers (PA) in transmission circuits, low-noise amplifiers (LNA) in reception circuits, antenna changeover switches and other semiconductor devices. RF modules are used for various types of wireless devices including smartphones and tablet PCs.
In the current competitive environment, the level of technology of competitors is very high. We will establish a competitive advantage by fostering or acquiring differentiated technologies.
We will differentiate ourselves from our competitors and capture business opportunities through the "Digital Envelope Tracking Technology” of Eta Wireless Inc., which we acquired in September 2021.
In the 5G and the 6G era, which is also called Beyond 5G, “ultra-low power consumption” and “ultra-reliable communication” are required. In order to survive in the global competition, we will continue to strengthen the high technological capabilities and high-quality monozukuri that Murata has cultivated over the years.
Multilayer LCP Product is a thinner multilayer resin substrate comprising LCP (liquid crystal polymer) sheets. It features exceptional RF characteristics and realizes a substrate with a stable performance due to low water absorption. It is also characterized by the ability to handle a flexible bending process because it does not require an adhesive layer. In addition, high multiple layers are possible by using Murata’s multilayer technology, enabling high flexibility in design. Multilayer LCP Product is used in smartphones, wearable devices, and other applications, contributing to smaller, thinner, and higher performance devices with low energy consumption.
In addition to ultra-high-frequency communications, we will aim to broaden our business portfolio and create new customer value by promoting expansion into growth markets, such as the wearable devices market and the optical communications market for AI data centers.
We will further enhance the value we provide to our customers by strengthening our three-dimensional structural technologies and high-density packaging technologies for high-speed optical communications in addition to our ultra-high-frequency and low-loss technologies with a view toward the 6G era.
We will strengthen our manufacturing capabilities and cost competitiveness by continuing productivity improvement activities. In addition, we will work on advance easures to establish supply chains for realizing sustainable material use.