Technology

Shaping the future of electronics
Platform technologies
Ceramic materials & production systems

Shaping the future of electronics

Murata has built an integrated system of production from raw materials to finished products, and we are continuously developing and accruing our fundamental technology base, such as materials technology, front-end process technology, product design technology, back-end process technology and analytical technology. We also aim at creating new markets and innovations by actively collaborating with outside partners and by developing core technologies and products that anticipate the future.

Platform technologies

Materials technology

Where innovation begins

“New electronic devices begin with new electronic components; new electronic components begin with new materials...” Based on that concept, Murata has created functional ceramic materials with outstanding characteristics. And we continuously further advance our technology through the development of new materials, with even better characteristics.

Materials design

Materials technology related to composition, crystal structure and simulation modeling of electrical properties (first-principles calculation).

Core shell structure of dielectric materials

Materials processing

Technology for synthesizing, dispersing and manufacturing powder material by controlling the particle diameter and crystal structure of ceramics.

2004 - Conventional process

2014 - New process

Front-end process technology

Perfected techniques.

Front-end process technologies enable us to produce designed functions in the best possible way, and it plays an important role in the miniaturization, slimming down, and high functionality of electronic components.

Laminating & stacking

Casting, high precision stacking and aligning, and laminating technology for up to sub-micron thickness dielectric sheets of uniform and small crystalline particles.

MLCC layer thickness reduction

Printing

High precision printing technology utilizing screen and other printing techniques to form thin, dense structures such as internal electrodes and wiring on ceramic sheets.

Thin internal electrodes

Sintering

Precise control of firing temperatures and atmosphere to produce desired crystal structures in electro ceramics.

Before and after sintering

Nano & thin film fabrication

Physical and chemical methods, including lithography and etching technologies, to form thin layers or films up to sub-micron levels.

Comb finger (MEMS technology)

Surface finishing

Controlling of electrochemical parameters to treat and enhance mechanical and electrical surface properties of electrical components utilizing electroless deposition and electroplating technologies.

Metal surface control techniques

Precision mechanical processing

High precision molding and shaping technology using injection molding, pressing and other mechanical techniques to create complex structures with high dimensional accuracy.

Injection molding with ceramic coumpounds

Product design technology

Shaping the future.

From single-function components to modules and on to total solution proposals, the value that Murata has provided over the years continues to evolve. We are involved in development of the technologies and products that can promptly respond to customer needs with an eye on the future.

High frequency design

Design techniques for high frequency (up to 60 GHz) components, devices and modules taking into account the complex electromagnetic coupling between circuits, elements and parasitic components.

Radio frequency module design technology

Device design

Technologies to achieve high performance compact devices using functional materials, mechanical design and software.

Inductor element structures

Embedded

Technology that achieves system design utilizing both circuit and embedded software design. The circuit design segment uses discrete analog and digital technology or custom IC technology. The embedded software segment utilizes algorithms and device driver software and middleware to support networking requirements.

Custom IC design

High reliability design

Technology to achieve high reliability products for harsh environmental conditions.

Cracks from mechanical stress to boards and noise from vibration of the capacitors are design issues.

Circuit design

Optimization of active and passive electronic components to achieve high efficiency and compact circuits.

Power loss switching operation

Simulation

Technology utilizing computer-aided numerical analysis and modeling in areas of electromagnetic field analysis, thermal and stress analysis.

Thermal analysis simulation of a power module.

Back-end process technology

Making innovation happen.

Thanks to our own production facilities and strong manufacturing (monozukuri) expertise, we possess numerous technologies and know-how to mass-produce products stably and efficiently.

Packaging

Technologies of back-end process to achieve downsizing and high reliability of devices, for example fine pitch bonding, high heat-resistant joining and specific sealing methods.

High-density packaging technology

Measurement

High speed and accurate techniques to measure the electrical properties of products.

EMC measurement

Automation

Precision mechanical design of manufacturing facilities for transporting ultra-small and irregular-shaped products, at high speed with low damage and high-precision control.

In-house mechanical design unit

Industrial Engineering

Technology used to increase productivity by analyzing and scientifically managing methods of manufacturing.

Production lines

Analytical technology

Attending to detail.

Efficient use of scientific analytical methods to confirm physical and electrical properties, composition and structure of materials, together with Murata’s advanced failure analysis systems, provide peace of mind to our customers.

Materials characterization

Characterization techniques used to confirm the physical and electrical properties, composition and structure of materials, through techniques such as non-destructive, thermal, organic, inorganic, and surface analysis.

Failure analysis

Technology used to reveal the cause of defective materials and products utilizing non-destructive, thermal, organic, inorganic, and surface analysis techniques.

Failure point detection in an ASIC by micro-probers combined with FE-SEM.

Ceramic materials & production systems

Wonder Stone

Murata refers to ceramics as a “wonder stone” because of its hidden and intriguing electric properties. Murata technology has unleashed many of the possibilities inherent in ceramics.

See more details about Wonder Stone

Integrated Production System

All technologies are directly in line with our markets and customers. Murata’s technologies are closely coordinated and integrated from materials to products. All technological departments aim at the same direction as our customers and try to propose new values. Murata’s strength comes from keeping our direction in line with our customers.

See more details about Integrated Production System

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