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We're exhibiting at SMT 2016

05/04/2016

SMT hybrid packaging event logo

We are pleased to announce that we are exhibiting at SMT Hybrid Packaging 2016. Europe's leading event on System Integration in Micro Electronics.

Our team looks forward to meeting you in Nuremberg and explaining more about our latest technologies.


Event details

Period: Tuesday April 26 - Thursday April 28
Location: NürnbergMesse, Germany
Register: click here
Booth No.: Hall 6, Booth 434

Overview

The Murata booth will be part of the Future Packaging Line, a live operating PCB assembly line. In this production environment Murata experts will explain how to surface mount or embed the MAGICSTRAP® into a PCB, alongside illustrating the benefits of turning a PCB into a Smart Object and making it ready for Industry 4.0

Join partnering automation makers that will be present at SMT in a discussion about the intergration of RFID into an electronics production. In addition, the latest on Bluetooth and WIFI modules, as well as Sensors, will be presented for factory automation makers searching for ways into Industry 4.0.



LIVE DEMOS

  • Smart PCB creation
  • MAGICSTRAP® embedded into PCB (MagicPCB®)
  • Tracking PCBs in production
  • Smart Plastic creation


Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.

For more information, visit Murata's website

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