High frequency devices and communications modules

RF modules are multi functional and highperformance electronic component units that realize an analogue high-frequency circuit that controls communications among wireless devices by integrating various key devices in a small package. This module is comprised of passive devices such as SAW filters and LC filters that distinguish RF, filter out noise and pick up required signals, highpower amplifiers (PA) in transmission circuits, low-noise amplifiers (LNA) in reception circuits, antenna changeover switches (Switch) and other semiconductor devices. RF modules are used for various types of wireless devices including smartphones and tablet PCs.

Murata internally develops various key devices that form the basis for module configuration and package technologies for modularization. Since the early 2000s, Murata’s technologies for passive devices such as SAW filters and LC filters and unique packaging technologies for LTCC substrate have been leading the RF module business. As for semiconductor devices such as PA, LNA and Switch, Murata acquired the PA business of Renesas Electronics Corporation and pSemi (formerly Peregrine Semiconductor) and integrated their technologies with passive devices and packaging technologies that have been Murata’s strengths, thereby expanding the RF module business.

Murata, which internally develops these key devices, is able to carry out integrated production. As a result, Murata maintains a strong competitive advantage in terms of production capability and quality, in addition to performance. Furthermore, with a global sales network and technical support system, Murata promptly identifies market and customer needs and ref lects such in product development in a timely manner, which gives Murata an advantage in application-specific RF module business.

With the arrival of 5G, which enables “highspeed, large-capacity communication,” “multiple concurrent connection communication” and “lowlatency real-time communication,” RF modules for realizing further high frequency, expansion of frequency bands and dual connectivity, in addition to multiple frequency bands and carrier aggregation for communications systems up to 4G, will become necessary. In addition, the modularization of electronic components is expected to advance in line with the miniaturization and increased functionalities of wireless devices.

It is expected that the unique benefits of 5G are to promote the diversification of IoT devices and bring many conveniences to life and work. We consider that the expansion of IoT devices will expand business opportunities not only with customers specializing in the communications market, such as smartphones and tablet PCs, but also with customers in new markets that we have not been involved with before.

In the 6G era, which is also called Beyond 5G, “ultra-low power consumption” and “ultra-reliable communication” are required. In order to survive in the global competition, we will continue to strengthen our “high technological capabilities” and “high-quality monozukuri (manufacturing)” that Murata has cultivated over the years. Murata will contribute to customers by promptly identifying future market and customer needs, while also leveraging our competitive advantages to propose RF modules most suitable to customers.

Connectivity modules are essential compound components that wirelessly connect various devices. These are mounted on familiar home appliances used in our daily lives, such as smartphones, tablet PCs, digital cameras and air conditioners, invehicle devices such as car navigation systems, and in various settings such that they enable users to download and upload photos and music from the Internet, and perform hands-free calling while driving.

In the communications market, with the rapid progress of the IoT society where all types of objects around us are connected to the Internet, new wireless communication standards such as Wi-Fi® 11ax, Cellular LPWA (Low Power Wide Area), UWB (Ultra Wide Band) and millimeter waves are also expected to spread. In the automotive market, along with the growing adoption and progress of wireless communication functions, use for invehicle detection is also increasing utilizing V2X Communication that connects with infrastructure and radar technology.

For 5G in millimeter wave bands, Murata can provide communication modules with low transmission loss utilizing composite technology which integrates proprietary multilayer resin substrates, high-performance IC and antennas. Countries around the world are now planning to provide communications services using millimeter wave bands, and started discussion regarding Beyond 5G (6G) standards. In a world in which everything can be connected through higher-speed communications, the use of connectivity modules is expected to expand further.

The growth of smartphones, which has been signif icantly rapid so far, is expected to slow down in the future. At the same time, competition among competitors is intensifying. Under such circumstance, Murata’s connectivity modules continue to provide products and value in response to various changes, such as 5G, new communication standards, and use of wireless technology in the areas other than data communication, by taking advantage of our strengths including proprietary multilayer resin substrates technology, design technologies to realize compactness, higher performance and high reliability, and software technologies to enhance connectivity. Murata strives to build a partnership with customers to be their first choice. In addition, Murata strives to contribute to the resolution of social issues and reduction of environmental burden by proposing appropriate products in diversified business opportunities such as environment and wellness.