Product Design Technology

Application/Solution Design Technology
(Circuit Substrate Design Technology)

Murata's Circuit substrate design technology is a technique for optimizing board layouts from the conception and design phase of module products. It aims to supply unique products based on the company's philosophy. This technology involves researching and selecting board materials and structures to enhance product value. Additionally, it incorporates CAD and CAE tools to ensure electrical performance (SI, PI, EMC) and physical performance (thermal stress, mechanical stress) through component arrangement and wiring design.

Murata develops a diverse range of module products across five markets: edge devices, IT infrastructure, Mobility, Environment, and Wellness, while accumulating design technologies tailored to the characteristics of each market.
For the edge device market, Murata designs ultra-thin and high-density boards to accommodate compact devices like smartphones.

For the IT infrastructure market, Murata introduces designs that balance 3D structures and low transmission losses for base stations and other applications.
For the Mobility and Environment markets, Murata ensures long-term reliability for automotive devices and social infrastructure equipment by implementing component arrangement and wiring designs that adapt to installation environments and fulfill fail-safe requirements.

For the Wellness market, Murata collaborates with material technologies to secure stability for wearable devices by advancing lightweight, stretchable, and flexible board designs.

The strength of Murata's Circuit substrate design technology lies in its ability to accommodate diverse modules tailored for different markets, achieved through layout design techniques that incorporate surrounding technologies accumulated via the development of various modules.

In addition to general printed wiring boards (PWBs), Murata maximizes the unique features of its self-developed and manufactured multilayer ceramic substrates (LTCC) and multilayer LCP products, as well as its advanced packaging technologies, to realize Circuit substrate design technologies that create the distinctiveness of Murata's module products.

To achieve this, Murata uses CAE tools to analyze and verify how the physical properties of substrate materials and manufacturing processes impact the electrical and physical performance of module products. It optimizes the substrate structure (number of layers and thickness), component placement, and wiring routes based on relationships with design rules and manufacturing rules.

Moreover, while developing surrounding technologies and incorporating cutting-edge innovations, Murata provides feedback to related technology departments, considering the strengths and weaknesses of Circuit substrate design perspectives. This approach emphasizes a balanced perspective in manufacturing practices.

Thus, the accumulation and optimization of layout design techniques that take surrounding technologies into account characterize Murata's Circuit substrate design technology and serve as a key strength supporting the competitiveness of its extensive range of module products.

Murata's Circuit substrate design technology has evolved into layout technology that enables optimized design, considering the balance of quality, cost, and performance, in line with the diversification of module products.
Initially, it began with layout technology based on printed Circuit substrate design rules, then expanded into multilayer ceramic substrates and multilayer LCP product technologies.

By adapting to design rules influenced by manufacturing processes and equipment and engaging in package technologies, Murata has increased opportunities for new technology development through discussions with internal departments and supplier companies.

Moving forward, Murata's module products aim to expand into new markets and applications in addition to the current five major markets. By utilizing new materials and methods such as nanoscale materials and glass substrate multilayer technology, circuit substrate design technology is expected to contribute more significantly to enhancing product competitiveness.

Murata's Circuit substrate design technology, which excels in absorbing new technologies, accumulating layout techniques that consider surrounding technologies, and optimizing these techniques, will continue to contribute to creating module products that reflect Murata's uniqueness.

This technology is applied to Murata's products and their production processes, from research and development through mass production.