Production Technology Plating Technology

Murata's plating technology is primarily used to maximize the characteristics of electronic components. The target electronic components are composed of various substrates, including functional ceramics such as dielectrics, magnetic materials, and semiconductors, as well as metals and resins. Some of these substrates are difficult to plate. The sheer variety of electronic components arises from differences in substrate combinations, shapes, and dimensions. To address this diversity, Murata has pursued process design technology, process management technique, and the optimal integration of both.

• Process design technology involves optimizing the materials, consumables, machines, process methods, treatment processes, and conditions for each specific product to perform plating on a wide range of target products. When necessary, we develop new technologies and process methods, combining these multiple factors to design the optimal plating process.
• Process management technique involves properly managing continuously used materials, consumables, and machines to stably form plating films with the required performance at the necessary locations within controlled parameters. For example, we watch and adjust variations in plating solution composition, impurity accumulation, and pH fluctuations. Additionally, we perform calibration to keep the accuracy of the instruments used for these measurements.

This systematic design and management forms the foundation for high-quality, highly reliable electronic component production.

Murata's strengths in plating technology lie in its extensive track record across a wide variety of electronic components, the presence of specialized technical teams, and an integrated system spanning from technology development to production.

• Regarding actual experience with diverse components, Murata has established and deployed plating technologies for a wide variety of electronic components over many years. Through technological development for sensitive substrates, difficult-to-plate semiconductor substrates, and ultra-miniaturized components, we have accumulated extensive expertise. Our experience solving issues like mounting defects and Sn (tin) whiskers has enhanced our technical capabilities and responsiveness.
• Plating technology is employed in nearly all Murata's proprietary products, making it one of the company's foundational technologies with high generality and importance. To support this technology, Murata has established a specialized team to drive the development of next-generation plating technologies. By collaborating with each production site, Murata creates synergies and has built a structure that ensures stable quality.
• Murata is characterized by its integrated system, spanning from raw material manufacturing to electronic component production. In plating technology as well, we collaborate with specialized teams—including product design, equipment design, mounting technology, and analysis/evaluation technology—from the initial stages of new product development. Our holistic optimization approach enables timely productization and rapid defect resolution.

Murata's plating technology has evolved over decades, adapting to the changing landscape of electronic components and the demands of the times.

• In the 1960s, we began with plating film formation on terminals for leaded components and metal parts. We also pioneered direct plating film formation on ceramic components ahead of the industry.
• From the 1980s onward, the development and proliferation of electrical and electronic devices drove the miniaturization and increased functionality of electronic components. In response, we shifted toward chip-shaped surface-mount components, achieving significant evolution across the entire process, including materials and equipment. This established a foundation enabling both mass production and stable quality.
• In the 1990s, we developed plating technologies suited for module components, such as low-temperature sintered substrates, and for special shapes and materials. This advanced our technology and expanded its scope.
• In the 2000s, amid growing environmental concerns, we advanced the development of processes free from harmful substances, including lead, cyanide compounds, and CFCs. Concurrently, we focused on water resource efficiency, such as reducing wastewater discharge, and lowering energy consumption. In recent years, we have also focused on resource recycling, contributing to the realization of a more sustainable society.
• Lately, we have advanced smarter operations through IoT integration, achieving a high level of balance between productivity, quality, and environmental responsiveness.

Moving forward, centered on “high reliability” and “sustainability,” we will continue to pursue advanced plating technologies and scientific management that contribute to the development of electrical and electronic devices.

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Link: Ceramic Capacitor
Link: Single-Layer Microchip Capacitors
Link: Thin Film Circuit Substrates (RUSUB)
Link: Inductors
Link: Outline of EMI Suppression Filters (EMC and Noise Suppression)
Link: Thermistors (Temperature Sensors, Current Control)
Link: Printed Circuit Products
Link: High frequency devices and communications modules