Production Technology Surface Mount Technology

Murata's surface mount technology develops materials, equipment, and design technologies in line with the miniaturization and characteristic optimization of its own electronic components. The results of our pursuit of new mounting technologies are provided as one aspect of product value.

• Micro-Printing Technology: Micro-printing of solder paste is critical for product miniaturization. We achieve this through material development suitable for micro-printing and mask design optimization in collaboration with material manufacturers.
• High-Precision Surface Mount Technology: We collaborate with various manufacturers to develop equipment and packaging materials that enable higher precision and faster mounting, pursuing high-density and narrow-pitch mounting.
• Soldering Control Technology: To achieve high-quality soldering, we optimize not only materials and equipment but also PCB land design and reflow conditions. We research these as critical application information and also provide technical support.
• Packaging Technology: We pursue advanced circuit design technology and cutting-edge mounting and packaging techniques that leverage it, developing and providing high-functionality module products.
• Reliability Enhancement Technology: Considering the usage environment after electronic component mounting, we evaluate soldering performance and joint reliability against stringent standards. We engage in manufacturing tailored to various applications from the design and development stages.

Murata's strength in surface mount technology is based on the philosophy of “challenging technological limits and co-creating new value.” This enables us to excel in ultra-fine narrow-spacing mounting (high-density mounting). Even when faced with difficult challenges, Murata collaborates with partner companies and customers to develop new materials and high-precision equipment, turning the impossible into reality. As a result, Murata has established ultra-fine narrow-pitch surface mount technology compatible with 0201M size components, enabling the widespread adoption of world-class smallest components while also delivering high-performance module products.

Beyond high-density mounting, we rapidly adopt new bonding materials and methods—such as low-temperature mounting, high-reliability mounting, bulk surface mount technology, and solder-alternative mounting techniques—while advancing research on product compatibility, challenges, and countermeasures. Through pioneering mounting technologies, we continue to expand the possibilities of electronic components, delivering new value to the market and our customers.

Murata's surface mount technology continues to evolve alongside the miniaturization of electronic components and the increasing density of module products. In the late 1970s, during the transition from through-hole devices (THD) to surface-mount devices (SMD), Murata pioneered the establishment of automated surface mount technology using tape reel supply. This initiative significantly contributed to the industry standardization and advancement of the reflow soldering process.

In the early 2000s, Murata was among the first to develop its own lead-free solder products. By providing these mounting and reliability applications, Murata also contributed to the realization and widespread adoption of lead-free solder mounting. Since then, Murata has continued to evolve by developing technologies such as fine printing for ultra-small components like 0402M and 0201M sizes, high-precision mounting, and solder joint technologies.

Moving forward, alongside pursuing advanced mounting technologies, we will focus on establishing sustainable mounting processes. This includes adopting low-environmental-impact materials, realizing energy-saving lines, and reducing waste. Furthermore, we will integrate with fine semiconductor manufacturing technologies and advance the development of new joining technologies. This will build the technological foundation to contribute to the future electronics society.

Link: Ceramic Capacitor
Link: Wi-Fi^® Modules / Wi-Fi^®+Bluetooth^® Modules
Link: Bluetooth^® Modules
Link: Isolated Gate Drive Power module