Examples of Technology Application ~Product Introduction~ Cutting-Edge SAW Devices Supporting Applications from 5G to IoT

Summary

Murata’s SAW devices are manufactured through design optimization using simulation technology, IDT (interdigital transducer) fabrication using thin-film and microfabrication technology, and resin encapsulation using packaging technology.
The strengths of Murata’s SAW devices include the I.H.P. SAW (Incredible High Performance SAW), which offers excellent resonator Q characteristics, temperature characteristics, and high heat dissipation, as well as a broad lineup in a wide range of compact sizes.
Murata’s SAW devices continue to respond flexibly and rapidly to the demand for high-density component mounting in limited board space driven by advances in communication technology, and to new specification requirements associated with 5G.

Product Description
Product Strengths
Product Evolution
Product Applications

Murata's SAW devices

Product Description

Murata’s SAW devices are high-selectivity filtering devices composed of a piezoelectric substrate and interdigital electrodes (IDTs).
Through optimized IDT design and careful selection of piezoelectric materials, these devices efficiently extract specific frequencies.
By stabilizing communication signals, Murata’s SAW devices contribute to the enhanced performance of electronic equipment.

Filtering Characteristics: In SAW devices, the center frequency is determined by the spacing of the interdigital electrodes, while the bandwidth is determined by the piezoelectric material used.
Murata optimizes both electrode design and material selection using advanced simulation technology, thereby minimizing filter loss.
Manufacturing Method: In the manufacturing process, interdigital electrodes are first formed on the piezoelectric substrate using photolithography technology.
The substrate is then diced into individual chips, which are bonded to a package (PKG) substrate.
Finally, the devices are encapsulated in resin to complete the finished products.
Device Features: The most prominent feature of Murata’s SAW devices is their high selectivity.
They efficiently extract radio frequencies tailored to specific applications, making them indispensable components in communication-related electronic devices.

Source of inserted image: Murata introduces High Performance ISM2.4 GHz Filter Applying I.H.P. SAW Technology

Pass characteristics of a typical SAW filter for Wi-Fi^TM.

Product Strengths

Murata’s SAW devices incorporate proprietary technologies that simultaneously achieve top-class performance and miniaturization.

High Performance: SAW devices are generally susceptible to performance variations caused by temperature changes. Murata has established TC-SAW (Temperature Compensated SAW) technology to minimize these effects. While conventional products typically exhibit temperature characteristics of approximately -50 ppm/°C, Murata’s SAW devices achieve temperature stability close to zero ppm.
Furthermore, through the development and mass production of I.H.P. SAW, which offers excellent Q characteristics, temperature stability, and high heat dissipation, Murata has expanded SAW applicability into high-difficulty domains that previously relied mainly on BAW (Bulk Acoustic Wave) devices.

TC-SAW technology achieving near-zero ppm temperature characteristics.

I.H.P. SAW technology achieving low insertion loss and high attenuation through excellent Q characteristics.
Miniaturization: Through design optimization and advanced packaging technology, Murata has significantly reduced chip size. Murata has achieved the world’s smallest 0907 size (0.9 mm × 0.7 mm) for single filters, a 1411 size (1.4 mm × 1.1 mm) for duplexers, and a 1612 size (1.6 mm × 1.2 mm) for quadplexers. This miniaturization enables the integration of high-performance devices even in extremely limited mounting spaces, supporting a wide range of products such as smartphones and wearable devices.

Product Evolution

Murata’s SAW devices have evolved in parallel with advances in communication technology, expanding their lineup to support nearly all newly introduced cellular communication frequencies while continuing to achieve further miniaturization.

After initially launching ceramic package-sealed types, Murata introduced CSP (Chip Size Package) technology to further reduce size.
Even with CSP types, Murata has reduced product area to less than half of the 2010 level.
More recently, Murata has developed I.H.P. SAW technology to realize higher performance and superior heat dissipation.

In response to revisions of standards and the emergence of new cellular frequencies, Murata also supports 5G technologies such as CA (Carrier Aggregation) and EN/DC (E-UTRA NR Dual Connectivity) by mass-producing multiplexers that integrate multiple transmit and receive band filters into a single package.
In this way, Murata’s SAW devices flexibly and rapidly adapt to the constantly evolving telecommunications market while delivering products that meet customer needs.

Evolution of SAW filter size. — Evolution of SAW filter sizes.

Product Applications

SAW devices are used across a broad range of applications, including mobile phones, Wi-Fi^TM routers, GNSS (Global Navigation Satellite Systems), wearable devices such as smartwatches, IoT devices, smart home appliances, and mobility.

They play a particularly important role in applications that require high frequency selectivity and the handling of weak signals, such as GNSS.

In addition, non-terrestrial networks (NTNs) that utilize satellites have recently entered practical use.
In these applications as well, as in cellular communications, the high selectivity of SAW devices is indispensable.

As wireless communications continue to diversify and advance, the application scope of SAW devices is expected to expand even further.

Technologies Used: